Specific Process Knowledge/Etch/ICP Metal Etcher/Aluminium: Difference between revisions

From LabAdviser
Bghe (talk | contribs)
No edit summary
Bghe (talk | contribs)
No edit summary
Line 114: Line 114:
|}
|}


===Al etch information supplied from STS===
[[Media:Al-etch.pdf|Al Etch Information (supplied from STS)]].
[[Media:Al-etch.pdf|Al Etch Information (supplied from STS)]].

Revision as of 10:06, 28 May 2015

Feedback to this page: click here


Aluminium etch

The aluminium etch has two steps:

Breakthrough
The breakthrough step is designed to break through the native aluminium oxide layer that is present on all aluminium surfaces. The duration of this step should remain fixed.
Main
The main step etches bulk aluminium.
Al etch
Parameter Process step
Breakthrough Main
Time (secs) 20 40 (variable)
HBr (sccm) - 15
Cl2 (sccm) 20 25
Pressure (mTorr) 2, Strike 3 secs @ 15 mTorr??? 1
Coil power (W) 600 500
Platen power (W) 125 100
Temperature (oC) 20 20
Spacers (mm) 30 30
Results
Etch rate ~350 nm/min (depending on features size and etch load)


Al etch made by Chantal Silvetre@danchip October 2014
Parameter Process step
Breakthrough Main
Time (secs) 20 40 (variable)
HBr (sccm) - 15
Cl2 (sccm) 20 25
Pressure (mTorr) 2, Strike 3 secs @ 15 mTorr??? 1
Coil power (W) 600 500
Platen power (W) 125 100
Temperature (oC) 20 20
Spacers (mm) 100 100
Results
Etch rate ~282 nm/min (depending on features size and etch load)

Al etch information supplied from STS

Al Etch Information (supplied from STS).