Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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|'''Chemical solution''' | |'''Chemical solution''' | ||
| | |6.5% HF and 30-40% NH<math>_4</math>F | ||
|5% HF | |5% HF | ||
|BHF with wetting agent | |BHF with wetting agent | ||