Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing: Difference between revisions

@@ Line 321: / Line 321: @@
 *'''(3610) DCH 150mm 5214E 1.5um'''
 *'''(3611) DCH 150mm 5214E 1.5um HMDS'''
-Spin-off: ???? rpm.
+Spin-off: 4500 rpm.
 {|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"
@@ Line 363: / Line 363: @@
 |-style="background:WhiteSmoke; color:black"
 |Silicon with native oxide
-|2.201 µm
+|1.507 µm
-|0.5%
+|1.0%
 |20/3 2015
 |taran
-|4" wafer, no HMDS. 9 points on one wafer, exclusion zone 5mm
+|SAT results. 6" wafer, with HMDS. 5 wafers measured: thickness is average of all 5; uniformity is worst case. 9 points on each wafer, exclusion zone 5mm.
+|-
+|-style="background:WhiteSmoke; color:black"
+|Silicon with native oxide
+|1.500 µm
+|0.6%
+|20/3 2015
+|taran
+|SAT results. 4" wafer, with HMDS. 5 wafers measured: thickness is average of all 5; uniformity is worst case. 9 points on each wafer, exclusion zone 5mm.
 |}