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Specific Process Knowledge/Characterization/Sample preparation: Difference between revisions

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{| border="1" cellspacing="1" cellpadding="1" align="middle"
![[image:WaferWithCast_2.jpg|300x300px|thumb|left|
![[image:WaferWithCast_2.jpg|300x300px|thumb|left|
  Tilt angle 20 degree. Close up. Bird View. Dark area is Silicon. Bright area is Silicon Dioxide. The Silicon Dioxide sidewall is corrugated.  
  Photograph of the temperature cured and released PDMS sample fixed to a silicon wafer ready for further inspection.
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![[image:Cast.jpg|300x300px|thumb|left|
![[image:Cast.jpg|300x300px|thumb|left|
  Tilt angle 20 degree. Close up. Bird View. Dark area is Silicon. Bright area is Silicon Dioxide. The Silicon Dioxide sidewall is corrugated.  
  Close up showing the replicated features in PDMS.
]]
]]
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