Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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== | ==Comparing dicing parameters for different materials== | ||
{| border="2" cellspacing="0" cellpadding="4" align="center" | |||
! | |||
!FilmTek 4000 | |||
!Ellipsometer | |||
|- valign="top" | |||
|'''Method''' | |||
|Reflection | |||
|Ellipsometry | |||
|-valign="top" | |||
|'''General description''' | |||
|Thin films up to 250 µm, Especially good for thick thin films and for wafer mapping | |||
|Good for very thin films down to a few Å | |||
|-valign="top" | |||
|'''Film thickness range''' | |||
|<250 µm (for silicon oxides > ~75nm) | |||
|20 Å to ~2µm (for silicon oxide) | |||
|-valign="top" | |||
|'''Film thickness accuracy''' | |||
|Very dependent of how good the model fits (if the fit is good it could be within 1% for a single layer) | |||
|Very dependent of how good the model fits. | |||
|-valign="top" | |||
|'''Index range''' | |||
|not any limits | |||
|not any limits | |||
|-valign="top" | |||
|'''Index accuracy''' | |||
|not known | |||
|not known | |||
|- valign="top" | |||
|'''Wavelength range''' | |||
|400-1000 nm | |||
|300-950 nm | |||
|-valign="top" | |||
|'''What kind of thin films can be measured''' | |||
|Any film that is transparent to the light in the given wavelength range | |||
ex: | |||
*Silicon Oxide | |||
*Silicon nitride | |||
*PolySilicon | |||
*Photoresists | |||
*SU8 | |||
*Other polymers | |||
*Very thin layers of metals (<20 nm) | |||
*and many more | |||
|Any film that is transparent to the light in the given wavelength range | |||
ex: | |||
*Silicon Oxide | |||
*Silicon nitride | |||
*Very thin layers of PolySilicon | |||
*Photoresists | |||
*SU8 | |||
*Other polymers | |||
*Very thin layers of metals (<20 nm) | |||
*and many more | |||
|- | |||
|} | |||
[[Image:Dicetest_001.jpg|300x300px|thumb|test|left]] | [[Image:Dicetest_001.jpg|300x300px|thumb|test|left]] |
Revision as of 15:04, 19 February 2008
Disco Automatic dicing saw, model DAD321
The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.
The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.
The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range.
A rough overview of the performance Disco DAD321 Dicer
Purpose | Equipment for dicing out samples. |
|
---|---|---|
Performance | Scan range xy |
Line scan x: 50 µm to 200 mm |
. | Scan range z |
50 Å to 262 µm |
. | Resolution xy |
down to 0.067 µm |
. | Resolution z |
1Å, 10Å or 20Å |
. | Max. scan depth as a function of trench width W |
1.2(W[µm]-5µm) |
Hardware settings | Tip radius |
|
Substrates | Substrate size |
|
. | Substrate material allowed |
|
Comparing dicing parameters for different materials
FilmTek 4000 | Ellipsometer | |
---|---|---|
Method | Reflection | Ellipsometry |
General description | Thin films up to 250 µm, Especially good for thick thin films and for wafer mapping | Good for very thin films down to a few Å |
Film thickness range | <250 µm (for silicon oxides > ~75nm) | 20 Å to ~2µm (for silicon oxide) |
Film thickness accuracy | Very dependent of how good the model fits (if the fit is good it could be within 1% for a single layer) | Very dependent of how good the model fits. |
Index range | not any limits | not any limits |
Index accuracy | not known | not known |
Wavelength range | 400-1000 nm | 300-950 nm |
What kind of thin films can be measured | Any film that is transparent to the light in the given wavelength range
ex:
|
Any film that is transparent to the light in the given wavelength range
ex:
|