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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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==Overview of dicing parameters for different materials==
==Comparing dicing parameters for different materials==
 
{| border="2" cellspacing="0" cellpadding="4" align="center"
!
!FilmTek 4000
!Ellipsometer
|- valign="top"
|'''Method'''
|Reflection
|Ellipsometry
|-valign="top"
|'''General description'''
|Thin films up to 250 µm, Especially good for thick thin films and for wafer mapping
|Good for very thin films down to a few Å
|-valign="top"
|'''Film thickness range'''
|<250 µm (for silicon oxides > ~75nm)
|20 Å to ~2µm (for silicon oxide)
|-valign="top"
|'''Film thickness accuracy'''
|Very dependent of how good the model fits (if the fit is good it could be within 1% for a single layer)
|Very dependent of how good the model fits.
|-valign="top"
|'''Index range'''
|not any limits
|not any limits
|-valign="top"
|'''Index accuracy'''
|not known
|not known
|- valign="top"
|'''Wavelength range'''
|400-1000 nm
|300-950 nm
|-valign="top"
|'''What kind of thin films can be measured'''
|Any film that is transparent to the light in the given wavelength range
ex:
*Silicon Oxide
*Silicon nitride
*PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
|Any film that is transparent to the light in the given wavelength range
ex:
*Silicon Oxide
*Silicon nitride
*Very thin layers of PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
|-
|}




[[Image:Dicetest_001.jpg|300x300px|thumb|test|left]]
[[Image:Dicetest_001.jpg|300x300px|thumb|test|left]]