Specific Process Knowledge/Thin Film deposition/ALD/TiO2 deposition using ALD: Difference between revisions
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The ALD window for titanium dioxide (TiO<sub>2</sub>) ranges from 120 <sup>o</sup>C to 350 <sup>o</sup>C. | The ALD window for titanium dioxide (TiO<sub>2</sub>) ranges from 120 <sup>o</sup>C to 350 <sup>o</sup>C. | ||
A low temperatures between 120 <sup>o</sup>C and 150 <sup>o</sup>C an anatase TiO<sub>2</sub> layer is | A low temperatures between 120 <sup>o</sup>C and 150 <sup>o</sup>C an anatase TiO<sub>2</sub> layer is grown in the ALD, and at higher temperatures between 300 <sup>o</sup>C and 350 <sup>o</sup>C an amorphous TiO<sub>2</sub> layer is grown. At temperatures between 150 <sup>o</sup>C and 300 <sup>o</sup>C the TiO<sub>2</sub> layer will be a mixture of both anatase and amorphous TiO<sub>2</sub>. | ||
For Si wafers, anatase TiO<sub>2</sub> is best grown on wafers without native oxide (removed using BHF), and amorphous TiO<sub>2</sub> is best grown on wafers with native oxide. | For Si wafers, anatase TiO<sub>2</sub> is best grown on wafers without native oxide (removed using BHF), and amorphous TiO<sub>2</sub> is best grown on wafers with native oxide. | ||
XPS measurements shows that at temperaturs below 120 <sup>o</sup>C the TiO<sub>2</sub> layer will be contaminated with about 1-3 % chlorine molecules from the TiCl<sub>4</sub> precursor. | XPS measurements shows that at temperaturs below 120 <sup>o</sup>C the TiO<sub>2</sub> layer will be contaminated with about 1-3 % chlorine molecules from the TiCl<sub>4</sub> precursor. This can be seen as small white dots in SEM images of the anatase TiO<sub>2</sub> layers. | ||
<b>Recipe</b>: TiO2 | <b>Recipe</b>: TiO2 | ||
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In the graphs below the TiO<sub>2</sub> thickness as function of number of cycles for deposition temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C can be seen. From the equations the number of cycles required for a certain thickess can be calculated. | In the graphs below the TiO<sub>2</sub> thickness as function of the number of cycles for deposition temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C can be seen. From the equations the number of cycles required for a certain thickess can be calculated. | ||
<gallery caption="Titanium dioxide thickness as function of number of cycles" widths=" | <gallery caption="Titanium dioxide thickness as function of number of cycles" widths="300px" heights="300px" perrow="5"> | ||
image:ALD_TiO2_grow_rate_150C.jpg| Temperature 150 <sup>o</sup>C. | image:ALD_TiO2_grow_rate_150C.jpg| Temperature 150 <sup>o</sup>C. | ||
image:ALD_TiO2_grow_rate_250C.jpg| Temperature 200 <sup>o</sup>C. | image:ALD_TiO2_grow_rate_250C.jpg| Temperature 200 <sup>o</sup>C. | ||
image:ALD_TiO2_grow_rate_350C.jpg| Temperature 250 <sup>o</sup>C. | image:ALD_TiO2_grow_rate_350C.jpg| Temperature 250 <sup>o</sup>C. | ||
</gallery> | </gallery> | ||
Below some SEM images of anatase TiO<sub>2</sub> deposited at 120 <sup>o</sup>C on Si trenches are shown. The width of the trenches is 200 nm, and the depth is 4 µm, i.e. the aspect ratio is 1:20. The number of cycles is 500, and this results in a TiO<sub>2</sub> layer of about 25 nm. From the SEM images it is seen that the TiO<sub>2</sub> layer covers the trenches very well. | Below some SEM images of anatase TiO<sub>2</sub> deposited at 120 <sup>o</sup>C on Si trenches are shown. The width of the trenches is 200 nm, and the depth is 4 µm, i.e. the aspect ratio is 1:20. The number of cycles is 500, and this results in a TiO<sub>2</sub> layer of about 25 nm. From the SEM images it is seen that the TiO<sub>2</sub> layer covers the trenches very well. | ||
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</gallery> | </gallery> | ||
Below some SEM images of | Below some SEM images of amorphous TiO<sub>2</sub> deposited at 300 <sup>o</sup>C on Si trenches are shown. The width of the trenches is 200 nm, and the depth is 4 µm, i.e. the aspect ratio is 1:20. The number of cycles is 500, and this results in a TiO<sub>2</sub> layer of about 26 nm. From the SEM images it is seen that the TiO<sub>2</sub> layer covers the trenches very well. | ||
<gallery caption="" widths="250px" heights="250px" perrow="5"> | <gallery caption="" widths="250px" heights="250px" perrow="5"> |
Revision as of 14:12, 8 May 2015
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The ALD window for titanium dioxide (TiO2) ranges from 120 oC to 350 oC.
A low temperatures between 120 oC and 150 oC an anatase TiO2 layer is grown in the ALD, and at higher temperatures between 300 oC and 350 oC an amorphous TiO2 layer is grown. At temperatures between 150 oC and 300 oC the TiO2 layer will be a mixture of both anatase and amorphous TiO2.
For Si wafers, anatase TiO2 is best grown on wafers without native oxide (removed using BHF), and amorphous TiO2 is best grown on wafers with native oxide.
XPS measurements shows that at temperaturs below 120 oC the TiO2 layer will be contaminated with about 1-3 % chlorine molecules from the TiCl4 precursor. This can be seen as small white dots in SEM images of the anatase TiO2 layers.
Recipe: TiO2
Temperature: 120 oC - 350 oC
TiCl3 | H2O | |
---|---|---|
Nitrogen flow | 150 sccm | 200 sccm |
Pulse time | 0.1 s | 0.1 s |
Purge time | 3.0 s | 4.0 s |
In the graphs below the TiO2 thickness as function of the number of cycles for deposition temperatures between 150 oC and 350 oC can be seen. From the equations the number of cycles required for a certain thickess can be calculated.
-
Temperature 150 oC.
-
Temperature 200 oC.
-
Temperature 250 oC.
Below some SEM images of anatase TiO2 deposited at 120 oC on Si trenches are shown. The width of the trenches is 200 nm, and the depth is 4 µm, i.e. the aspect ratio is 1:20. The number of cycles is 500, and this results in a TiO2 layer of about 25 nm. From the SEM images it is seen that the TiO2 layer covers the trenches very well.
Below some SEM images of amorphous TiO2 deposited at 300 oC on Si trenches are shown. The width of the trenches is 200 nm, and the depth is 4 µm, i.e. the aspect ratio is 1:20. The number of cycles is 500, and this results in a TiO2 layer of about 26 nm. From the SEM images it is seen that the TiO2 layer covers the trenches very well.
Evgeniy Shkondin, DTU Danchip, 2014.