Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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*HMDS priming | *HMDS priming | ||
*Spin coating of PGMEA based AZ resists | *Spin coating of PGMEA based AZ resists | ||
*Spin coating of E-beam resists <sup>1)</sup> | |||
*Soft baking | *Soft baking | ||
|- | |- | ||
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|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
* 50 mm wafers | * 50 mm wafers <sup>1)</sup> | ||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
* 200 mm wafers | * 200 mm wafers <sup>1)</sup> | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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|- | |- | ||
|} | |} | ||
<sup>1)</sup> Requires tool change. | |||
<br clear="all" /> | <br clear="all" /> | ||