Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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-*Spin coating and soft baking UV sensative resists
+*HMDS priming
-*Spin coating and soft baking E-beam resists
+*Spin coating and soft baking of PGMEA based AZ resists
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 !style="background:silver; color:black;" align="center" width="60"|Resist
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-* AZ5214E
+* Permanent lines:
-* AZ4562
+** AZ MiR 701 (29cps)
-* E-beam resists
+** AZ nLOF 2020
+** AZ 5214E
+* 100cc syringe dispense
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 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
 |style="background:LightGrey; color:black"|Coating thickness
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-* AZ5214E 1-4,2 µm
+* AZ 5214E 1.5-5 µm
-* AZ4526 6,2-25 µm
+* AZ 4562 5-15 µm
-* E-beam resits 0,1-1 µm
+* AZ MiR 701 1.5-4 µm
+* AZ nLOF 2020 1.5-5 µm
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-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
 |style="background:LightGrey; color:black"|Spin speed
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-- 5000 rpm
+- 7000 rpm
 |-
 |style="background:LightGrey; color:black"|Spin acceleration
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 - 10000 rpm/s
-|-
-|style="background:LightGrey; color:black"|Hotplate temperature
-|style="background:WhiteSmoke; color:black" align="center"|
-* 90°C for softbaking of AZ5214E resist
-* 100°C for softbaking of AZ4562 resist
-* 110°C for reverse baking of AZ5214E resits
-* 180°C for softbaking of e-beam resits
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 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
@@ Line 483: / Line 479: @@
 * 100 mm wafers
 * 150 mm wafers
+* 200 mm wafers
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 | style="background:LightGrey; color:black"|Allowed materials
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-All cleanroom materials except III-V materials
+Silicon and glass
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 |style="background:LightGrey; color:black"|Batch
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-- 24
+-25
 |-
 |}