Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]''' | '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]''' | ||
=== Equipment performance and process related parameters === | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
*Spin coating and soft baking UV sensative resists | |||
*Spin coating and soft baking E-beam resists | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Resist | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* AZ5214E | |||
* AZ4562 | |||
* E-beam resists | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | |||
|style="background:LightGrey; color:black"|Coating thickness | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* AZ5214E 1-4,2 µm | |||
* AZ4526 6,2-25 µm | |||
* E-beam resits 0,1-1 µm | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | |||
|style="background:LightGrey; color:black"|Spin speed | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
100 - 5000 rpm | |||
|- | |||
|style="background:LightGrey; color:black"|Spin acceleration | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
100 - 10000 rpm/s | |||
|- | |||
|style="background:LightGrey; color:black"|Hotplate temperature | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* 90°C for softbaking of AZ5214E resist | |||
* 100°C for softbaking of AZ4562 resist | |||
* 110°C for reverse baking of AZ5214E resits | |||
* 180°C for softbaking of e-beam resits | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
* 50 mm wafers | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
All cleanroom materials except III-V materials | |||
|- | |||
|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
1 - 24 | |||
|- | |||
|} | |||
<br clear="all" /> | |||
==Spin Coater: RCD8== | ==Spin Coater: RCD8== | ||