Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range.
The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range.


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===A rough overview of the performance Disco DAD321 Dicer===


{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|Equipment for dicing out samples.||style="background:WhiteSmoke; color:black"|
*Single point profiles
*Wafer mapping
*Stress measurements by measuring wafer bow
*Surface roughness on a line scan
|-
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
Line scan x: 50 µm to 200 mm
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Scan range z
|style="background:WhiteSmoke; color:black"|
50 Å to 262 µm
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution xy
|style="background:WhiteSmoke; color:black"|
down to 0.067 µm
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution z
|style="background:WhiteSmoke; color:black"|
1Å, 10Å or 20Å
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:WhiteSmoke; color:black"|
1.2(W[µm]-5µm)
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Tip radius
|style="background:WhiteSmoke; color:black"|
*5 µm 45<sup>o</sup> cone
|-
!style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*up to 8"
|-
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
*In principle all materials
|-
|}
<br clear="all" />




Revision as of 14:53, 19 February 2008

Dicer positioned on 1. floor bldg 346 room


Disco Automatic dicing saw, model DAD321

The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.

The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range.


A rough overview of the performance Disco DAD321 Dicer

Purpose Equipment for dicing out samples.
  • Single point profiles
  • Wafer mapping
  • Stress measurements by measuring wafer bow
  • Surface roughness on a line scan
Performance Scan range xy

Line scan x: 50 µm to 200 mm

. Scan range z

50 Å to 262 µm

. Resolution xy

down to 0.067 µm

. Resolution z

1Å, 10Å or 20Å

. Max. scan depth as a function of trench width W

1.2(W[µm]-5µm)

Hardware settings Tip radius
  • 5 µm 45o cone
Substrates Substrate size
  • up to 8"
. Substrate material allowed
  • In principle all materials





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