Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

Revision as of 14:35, 19 February 2008

Disco Automatic dicing saw, model DAD321

The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.

The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range.

Revision as of 14:31, 19 February 2008 view source Hvj (talk \| contribs) danchip 43 edits No edit summary ← Older edit		Revision as of 14:35, 19 February 2008 view source Hvj (talk \| contribs) danchip 43 edits No edit summary Newer edit →
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	[[Image:Disco_DAD_321_Dicer.jpg\|300x300px\|thumb\|~~test~~\|~~left~~]]		[[Image:Disco_DAD_321_Dicer.jpg\|300x300px\|thumb\|Dicer positioned on 1. floor bldg 346 room\|right]]