Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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 == Field stitching ==
-In this experiment, several writing fields (1 mm x 1 mm) were stitched together. Vernier marks on the edges of each writing field shows the field stitching bewteen fields.
+In this experiment, several writing fields (1 mm x 1 mm) were stitched together. Vernier scales on the edges of each writing field shows the field stitching bewteen fields.
-After exposure and development, 5/45 nm Ti/Au has been depsoited in Wordentec, and lift-off performed in a beaker with AR 600-71. In order to make the lift-off succeed, it was necessary to immerse the beaker 4s in an ultrasonic bath.
+{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"  style="width: 95%"
+|-
+|-
+|-style="background:Black; color:White"
+!colspan="6"|wafer 11.17 Stitching accuracy, Processed by TIGRE, April 2015
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Resist
+!E-beam exposure
+!Development
+!Metallisation
+!Lift-off
+!Characterisation
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+|CSAR AR-P6200 AllResist, 400 rpm, 60s, softbaked 60s @ 150degC
+|JBX9500 E-2, 2nA aperture 5, dose 300 µC/cm2, L1: 1st set of Vernier scales on edges (North, Upper Right, East, Lower Right, South, Lower Left, West, Upper Left) of entire writi9ng field
+|AR-600-546, 60 s
+|5 nm Ti, 45 nm Au, Wordentec (D-2)
+|AR-600-71, 5-10 min, 4s ultrasonic (D-3)
+|Zeiss Supra 60VP, 10kV, Inlens detector
+|-
+|}
 [[File:FieldToField.png|700px]]