Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
| Line 331: | Line 331: | ||
|} | |} | ||
'''1 Material:''' Global marks or chip marks should be clearly visible in a 100keV SEM, i.e. preferably defined by Ti/Au or another 'heavy' metal, alternatively the wafer marks should be etched. | '''1 Material:''' Global marks or chip marks should be clearly visible in a 100keV SEM, i.e. preferably defined by Ti/Au or another 'heavy' metal, alternatively the wafer marks should be etched. In Si, etched mark should be around 1 µm deep in order to be detectable by the machine. Shallow etched (even 200 nm etched profiles) global marks or global marks in Si or marks defined by a light metal as Al can be hard to locate manually as well as automatically by the machine. | ||
'''2 Design: ''' | '''2 Design: ''' | ||