Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions

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===IMEC process for cleaning of wafers before fusion bonding:===
===IMEC process for cleaning of wafers before fusion bonding:===


Ophav IMEC
''Ophav IMEC
Spørg Karen om der er lavet modificeringer
Spørg Karen om der er lavet modificeringer''


{| border="1" cellspacing="0" cellpadding="5" align="center"
{| border="1" cellspacing="0" cellpadding="5" align="center"
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| Pre bonding cleaning of Si wafers with cavities and SOI wafers with nitride
| Pre-bond cleaning of Si wafers prior to fusion bonding.
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|Use wafers with cavities on and SOI wafers
*Takes 1½ hours
*Takes 1½ hours
*Orient flat to minimize handling
*Orient flat to minimize handling
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Pour up H2SO4 first, put wafers in carrier (USE this in steps4.1-4.6), add H2O2, wait 30 sec, dip wafers.
Pour up H2SO4 first, put wafers in carrier (USE this in steps4.1-4.6), add H2O2, wait 30 sec, dip wafers.
|Maybe clean the tank the day before!
|Maybe clean the tank the day before!
Put into dedicated wet box for IMEC
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|3
|3
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Time: 100 sec
Time: 100 sec
(two black spots)
(two black spots)
|Clean tank (cleanroom 4, tank for buffer with wetting solution) and make your own, it needs 2 bottles
|Clean tank (cleanroom 4, tank for buffer with wetting solution) and make your own. Mix in dedicated bottle (IMEC) in fume hood and add to tank using BHF pump from RCA fumehood!  
Bottles are in service room 2 on the left, pump is by Leica microscope in cleanroom 3
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|Bottle for mixing is in service room 2, use BHF pump from RCA fumehood!
.
Put into dedicated wet box for IMEC
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|5
|5
|Rinse
|Rinse
|2 min. rinse
|2 min. rinse
|
|Put into dedicated wet box for IMEC
|
 
|.
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|6
|6
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Makes wafers hydrophilic
Makes wafers hydrophilic
|Put into dedicated wet box for IMEC
|.
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|7
|7
|Rinse & spin dry
|Rinse & spin dry
|5 min rinse
|5 min rinse
|
|.
|Put into dedicated wet box for IMEC
|.
|-
|-
|8
|8
|Put wafers in new clean carrier box
|Put wafers in new clean carrier box
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Revision as of 12:04, 11 February 2008

Ikke godkendt

IMEC process for cleaning of wafers before fusion bonding:

Ophav IMEC Spørg Karen om der er lavet modificeringer

Step Process Details Comments Comments
1 Pre-bond cleaning of Si wafers prior to fusion bonding.
  • Takes 1½ hours
  • Orient flat to minimize handling
  • Preferable done just before bonding!
 Get CLEAN box for wafers!!!
2 Piranha Mixture: H2SO4:H2O2 (4:1)

Temp: 80 oC Time: 5 min (a yellow and a black spot)

Clean tank (cleanroom 4, 7-up bath for wafers) and make your own or make in dedicated glass.

Pour up H2SO4 first, put wafers in carrier (USE this in steps4.1-4.6), add H2O2, wait 30 sec, dip wafers.

Maybe clean the tank the day before!
3 Rinse 2 min. rinse Put into dedicated wet box for IMEC
4 IMEC DI water:5% HF:isopropanol (100:10:1)

Temp: 25 oC Time: 100 sec (two black spots)

Clean tank (cleanroom 4, tank for buffer with wetting solution) and make your own. Mix in dedicated bottle (IMEC) in fume hood and add to tank using BHF pump from RCA fumehood!

.

5 Rinse 2 min. rinse Put into dedicated wet box for IMEC .
6 Piranha Not nitride wafers!

Mixture: H2SO4:H2O2 (4:1) Temp: 80 oC Time: 20 min

Re-use previous piranha

Makes wafers hydrophilic

.
7 Rinse & spin dry 5 min rinse . .
8 Put wafers in new clean carrier box . . .
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