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Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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|'''Batch size'''
|'''Batch size'''
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1-25 wafers at a time
1-5 4" in beaker
1-25 wafers at a time in PP-etch bath
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1-25 wafer at a time
1-5 4" wafer at a time
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|-
|'''Size of substrate'''
|'''Etch bath'''
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|Beaker or PP-etch bath in the fume hood in cleanroom 2.
4" wafers
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4" wafers
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|'''Allowed materials'''
|'''Allowed materials'''
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No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
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*Aluminium
No restrictions when used in beaker.
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
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|-
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