Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
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1-25 wafers at a time | 1-5 4" in beaker | ||
1-25 wafers at a time in PP-etch bath | |||
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1- | 1-5 4" wafer at a time | ||
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| | |Beaker or PP-etch bath in the fume hood in cleanroom 2. | ||
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No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. | No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. | ||
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No restrictions when used in beaker. | |||
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Revision as of 10:20, 11 February 2008
Etching of Titanium
Etching of Titanium is done wet at Danchip. We have two solutions for titanium etching:
- BHF
- Cold RCA1 (as stripper)
Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.
Comparing the two solutions
| BHF | Cold RCA1 | |
|---|---|---|
| General description |
Etch of titanium with or without photoresist mask. |
Etch of titanium (as stripper) |
| Chemical solution | HF:NHF | NH3OH:H2O2:H2O - 1:1:5 |
| Process temperature | Room temperature | Room temperature |
| Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
None |
| Etch rate |
Not known (it bubbles while etching) |
Not known |
| Batch size |
1-5 4" in beaker 1-25 wafers at a time in PP-etch bath |
1-5 4" wafer at a time |
| Etch bath | Beaker or PP-etch bath in the fume hood in cleanroom 2. | |
| Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. |
No restrictions when used in beaker. |