Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions
Appearance
| Line 33: | Line 33: | ||
|- | |- | ||
!style="background:#f0f0f0;"|Which wafers are allowed to enter the furnace: | !style="background:#f0f0f0;"|Which wafers are allowed to enter the furnace: | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''A1 Boron drive-in''' | | valign="top" align="center" style="background:#f0f0f0;"|'''A1 <br />Boron drive-in''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''A3 Phosphorous drive-in''' | | valign="top" align="center" style="background:#f0f0f0;"|'''A3 <br />Phosphorous drive-in''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''C1 Gate oxide''' | | valign="top" align="center" style="background:#f0f0f0;"|'''C1 <br />Gate oxide''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''C2 Anneal oxide''' | | valign="top" align="center" style="background:#f0f0f0;"|'''C2 <br />Anneal oxide''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''C3 Anneal bond''' | | valign="top" align="center" style="background:#f0f0f0;"|'''C3 <br />Anneal bond''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''C4 Anneal aluminium''' | | valign="top" align="center" style="background:#f0f0f0;"|'''C4 <br />Anneal aluminium''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''Nobel''' | | valign="top" align="center" style="background:#f0f0f0;"|'''Nobel''' | ||
| valign="top" align="center" style="background:#f0f0f0;"|'''RTP''' | | valign="top" align="center" style="background:#f0f0f0;"|'''RTP''' | ||