Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/SOI/SOI: Difference between revisions
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(Created page with " {| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" |+ '''Process runs''' |- ! rowspan="2" width="40"| Date ! colspan="4" width="120"| Substrate Informat...") |
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| Line 24: | Line 24: | ||
| 10 minute TDESC clean | | 10 minute TDESC clean | ||
| danchip/jml/showerhead/SOI/SOI, 96 cyc or 8:00 mins | | danchip/jml/showerhead/SOI/SOI, 96 cyc or 8:00 mins | ||
| | | S004745 | ||
! New showerhead | ! New showerhead | ||
| | | | ||
Revision as of 16:18, 16 January 2015
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 15/12-2014 | 4" Wafer with travka65 mask | AZ standard | Si / 65 % | Pegasus/jmli | 10 minute TDESC clean | danchip/jml/showerhead/SOI/SOI, 96 cyc or 8:00 mins | S004745 | New showerhead |
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