Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions
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| 4" Wafer with travka50 mask | | 4" Wafer with travka50 mask | ||
| AZ standard | | AZ standard | ||
| Si / 50 | | Si / 50 % | ||
| Pegasus/jmli | | Pegasus/jmli | ||
| 10 minute TDESC clean | | 10 minute TDESC clean | ||