Specific Process Knowledge/Lithography/CSAR: Difference between revisions
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!colspan="7" width=85%| SEM inspection of wafer 6.13, 30 nm exposed pattern, shot pitch 7 nm | !colspan="7" width=85%| SEM inspection of wafer 6.13, 30 nm exposed pattern, shot pitch 7 nm | ||
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! 270 [muC/cm2] | ! 270 [muC/cm2] | ||