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Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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The typical flow for resist spinning is divided in 3 steps: video, spinning and soft bake.  
The typical flow for resist spinning is divided in 3 steps: video, spinning and soft bake.  
You need to create the separated recipe for each station an then collect the recipes in a flow. For video station we have 3 standard recipes for 3 different wafer sizes: 2inch, 4inch, 6inch. To create a recipe for coater station you need to describe spinning sequence using the predefined functions. Then you create recipe for hotplates after all recipes are created they can be set together in the different flows. It is why we are not recommending the user just change some parameters in the recipe, this change can effect some other flows.
You need to create the separated recipe for each station an then collect the recipes in a flow. For video station we have 3 standard recipes for 3 different wafer sizes: 2inch, 4inch, 6inch. To create a recipe for coater station you need to describe spinning sequence using the predefined functions. Then you create recipe for hotplates after all recipes are created they can be set together in the different flows. It is why we are not recommending the user just change some parameters in the recipe, this change can effect some other flows.
 
 
*[[Specific Process Knowledge/Lithography/Coaters/SSE Spinner AZ5214e coating|SSE Spinner AZ5214e coating on SSE Spinner]]
 
 
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Here is the table with the standard flows.  
Here is the table with the standard flows.