Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions
No edit summary |
No edit summary |
||
| Line 46: | Line 46: | ||
! New showerhead | ! New showerhead | ||
| | | | ||
[[file:S004671-04.jpg|150px|frameless ]] | |||
[[file:S004671-05.jpg|150px|frameless ]] | |||
[[file:S004671-06.jpg|150px|frameless ]] | |||
[[file:S004671-07.jpg|150px|frameless ]] | |||
|- | |- | ||
Revision as of 15:46, 17 December 2014
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 18/8-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004257 | OLD showerhead |
|
| 1/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004671 | New showerhead |
|
| 15/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004746 | New showerhead |
|
