Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions
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| 15/12-2014 | |||
| 4" Danchip QC Wafer | |||
| 1.5 µm AZ resist, daq2 mask | |||
| Si / 10 % | |||
| Pegasus/jmli | |||
| 10 minute TDESC clean, 10 minute PR strip post process | |||
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | |||
| S004746 | |||
! New showerhead | |||
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