Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions

From LabAdviser
← Older editNewer edit →
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,416 edits
No edit summary
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,416 edits
No edit summary
Line 17: Line 17:
! width="40" | Comments
! width="40" | Comments
|-
|-
| 18/8-2014
| 1/12-2014
| 4" Danchip QC Wafer  
| 4" Danchip QC Wafer  
| 1.5 µm AZ resist, daq2 mask
| 1.5 µm AZ resist, daq2 mask
Line 24: Line 24:
| 10 minute TDESC clean, 10 minute PR strip post process
| 10 minute TDESC clean, 10 minute PR strip post process
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes  
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes  
| S004257
| S004671
! OLD showerhead  
! New showerhead  
|  
|  
[[file:S004257-08.jpg|150px|frameless ]]
No SEM images due to bad cleaving
[[file:S004257-09.jpg|150px|frameless ]]
 
[[file:S004257-10.jpg|150px|frameless ]]
[[file:S004257-11.jpg|150px|frameless ]]
[[file:S004257-12.jpg|150px|frameless ]]
[[file:S004257-13.jpg|150px|frameless ]]
[[file:S004257-14.jpg|150px|frameless ]]
|-
|-
|}
|}

Revision as of 13:52, 16 December 2014

Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
1/12-2014 4" Danchip QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004671 New showerhead

No SEM images due to bad cleaving

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA&oldid=17576"