Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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== | == Change of showerhead in December 2014 == | ||
The showerhead that distributes the process gasses inside the plasma source has been changed. The new showerhead has larger holes that reduce the gas flow resistance. Flowing easier from the fast switching MFC's to the chamber, the gas will not mix up as easily. This enables us to run Bosch processes with shorter cycles times. Shorter cycles times means smaller scallops and hence lower roughness. | The showerhead that distributes the process gasses inside the plasma source has been changed. The new showerhead has larger holes that reduce the gas flow resistance. Flowing easier from the fast switching MFC's to the chamber, the gas will not mix up as easily. This enables us to run Bosch processes with shorter cycles times. Shorter cycles times means smaller scallops and hence lower roughness. | ||
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Starting in December 2014 we will rute | Starting in December 2014 we will rute | ||
== Additional information == | |||
'''Wafer bonding''' | '''Wafer bonding''' | ||