Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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The procedure is as follows: | The procedure is as follows: | ||
==When deposition on one side of the wafer== | |||
#Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | #Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | ||
#Deposite the thin film | #Deposite the thin film | ||
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#Use the program for stress measurement in the profilometer software on the profilometer you used for the measurements. Use both the pre-stress measurement and the post-stress measurement. | #Use the program for stress measurement in the profilometer software on the profilometer you used for the measurements. Use both the pre-stress measurement and the post-stress measurement. | ||
==When deposition on both sides of the wafer== | |||
#Deposite the thin film | #Deposite the thin film | ||
#Pre-measurement: Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | #Pre-measurement: Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | ||