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Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions

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Stress measurements of a thin film can be done measuring the wafer bow before and after deposition of the film. If the film is deposited on both sides of the wafer you can measure the bow after deposition and after removing the film from one of the sides.
Stress measurements of a thin film can be done measuring the wafer bow before and after deposition of the film. If the film is deposited on both sides of the wafer you can measure the bow after deposition and again after removing the film from one of the sides.


The procedure is as follows:
The procedure is as follows:
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