Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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| Correct design of global (wafer) mark || Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer || Example of chip with 4 chip marks | | Correct design of global (wafer) mark || Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer. Positions of global marks are entered in jdf file using wafer coordinate system (flat upward). || Example of chip with 4 chip marks. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0). | ||
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