Specific Process Knowledge/Direct Structure Definition: Difference between revisions

!Sample with resist.<br> A glass mask with desired pattern. For mask layout software see [[Specific Process Knowledge/Lithography/UVLithography/Mask Design| Mask design]]

!Sample with resist.<br> A 3D CAD model file in GWL format. Included software can convert 3D model in STL (Standard Tessellation Language) format to GWL files.  

!Sample with polymer.<br> A stamp with the wanted pattern, usually in Si or SiO\rm{_2} however other materials could also be used.  

!A stamp/shim with the wanted pattern, usually in Ni og Al.

!A 2D CAD model file in DXF or CONX format. [[Specific Process Knowledge/Lithography/UVLithography/Mask Design| Clewin5]] can convert GDS and CIF files to DXF format.  

!Number of lines and pitch in each direction. Your wafer.

!medium: 5-10 wafers/hour depending on exposure time

!slow: 1 sample/day

!medium: 5-10 wafers/hour depending on imprint time

!fast: 10-100/hour

!medium-slow: 0.1-1 wafers/hour depending on pattern complexity

!medium: ½-3 wafers/hour depending on material and # of cuts (Si cuts at 5mm/s, SiO2 at 0.5-1 mm/s)

!1µm - wafer size

!100nm - mm

!100nm - µm

!nm - mm

!100µm - wafer size

!saw blade width 60µm or 200µm. Has to cut full diameter of wafer.

!NA

!2-Photon Polymerization Lithography ??

!Nano Imprint Lithography ??

!Polymer Injection Molder ??

!50-100µm width/~1mm depth, sloping walls

!60µm width/2mm depth, vertical walls

!resist developing/baking

!resist developing/baking, ?? 2-Photon Polymerization Lithography

!Dry Etch back (RIE), ?? Nano Imprint Lithography

!None, ??Polymer Injection Molder

!Sample cleaning with Ultrasound etc.

!None

!2D

!3D

!2D. different depths possible

!2D. different depths possible

!2D. different depths possible

!1D. different depths possible

!UV Lithography

!2-Photon Polymerization Lithography

!Nano Imprint Lithography

!Polymer Injection Molder

!Laser Micromachining Tool

!Dicing saw