Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
| Line 315: | Line 315: | ||
'''Please note that manual alignment (using the SEM) is no longer allowed.''' You should use semi-automatic alignment only. In rare cases where semi-automatic alignment is impossible, you should remove the resist around the wafer marks before loading the wafer/chip into the machine. | '''Please note that manual alignment (using the SEM) is no longer allowed.''' You should use semi-automatic alignment only. In rare cases where semi-automatic alignment is impossible, you should remove the resist around the wafer marks before loading the wafer/chip into the machine. | ||
{| cellpadding="2" style="border: 2px solid darkgray;" align="right" | {| cellpadding="2" style="border: 2px solid darkgray;" align="right" | ||
| Line 334: | Line 329: | ||
| [[File:Chip example.png|right|200px]] | | [[File:Chip example.png|right|200px]] | ||
|- align="center" | |- align="center" | ||
| Correct mark || Definition of length and width, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended | | Correct mark || Definition of length and width, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || P and Q mark positions on wafer || Example of chip with 4 chip marks | ||
|} | |} | ||