Specific Process Knowledge/Lithography/Baking: Difference between revisions
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!Restrictions <br> (Not allowed) | !Restrictions <br> (Not allowed) | ||
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|III-V, copper, steel substrates | |III-V, copper, steel substrates | ||
Pb, Te films | |||
|III-V substrates unless specifically stated | |||
Respect the restrictions on the associated spin coater | |||
|III-V, copper, steel substrates | |||
|III-V, low Tg polymer, copper, steel substrates | |||
|III-V, low Tg polymer, copper, steel substrates | |III-V, low Tg polymer, copper, steel substrates | ||
Resist is not allowed | |||
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