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Specific Process Knowledge/Lithography/Baking: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
Line 37: Line 37:
Manual convection bake
Manual convection bake
*Hard bake
*Hard bake
*Post-exposure bake
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Manual convection bake
Manual convection bake
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Fixed at 90°C
Fixed at 90°C
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120 - 250°C
110 - 250°C


Return to 120°C after use
Return to 110°C after use
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Fixed at 250°C
Fixed at 250°C
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!Allowed materials
!Allowed materials
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Silicon, glass, and polymer substrates
All substrates


Film or pattern of all types
Film or pattern of all types
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|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Restrictions
!Restrictions <br> (Not allowed)
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|III-V, copper, steel substrates <br> Pb, Te films
|III-V substrates unless specifically stated <br> Respect the restrictions on the associated spin coater
|III-V, copper, steel substrates
|III-V, copper, steel substrates
 
|III-V, low Tg polymer, copper, steel substrates
Pb, Te films
|III-V, low Tg polymer, copper, steel substrates <br> Resist is not allowed
|III-V substrates unless specifically stated
 
Respect the restrictions on the associated spin coater
|III-V substrates
 
Pb, Te films
|III-V, copper, steel substrates
|Resist is not allowed
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|-
|}
|}
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