Jump to content

Specific Process Knowledge/Bonding: Difference between revisions

Bghe (talk | contribs)
No edit summary
Kabi (talk | contribs)
Line 33: Line 33:
!Bonding temperature
!Bonding temperature
|Depending on the eutecticum 310°C to 400°C.  
|Depending on the eutecticum 310°C to 400°C.  
|Depending on defects 50°C to 400°C.  
|Depending on defects 50°C to 400°C. For strong bonding strengths a subsequently anneal at 1000-1100°C is required.
|Depending on the voltage 300°C to 500°C Standard is 400°C.  
|Depending on the voltage 300°C to 500°C Standard is 400°C.  
|-
|-