Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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|style="background:WhiteSmoke; color:black"|<b>Spin dryer 3</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 3</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
|style="background:WhiteSmoke; color:black"|<b>Single Wafer Spin dryer 1</b>
|style="background:WhiteSmoke; color:black"|<b>Single Wafer Spin dryer 2</b>
|style="background:WhiteSmoke; color:black"|<b>Single Wafer Spin dryer 3</b>
|style="background:WhiteSmoke; color:black"|<b>Critical point dryer</b>
|style="background:WhiteSmoke; color:black"|<b>Critical point dryer</b>
|style="background:WhiteSmoke; color:black"|<b>Ethanol fume dryer</b>
|style="background:WhiteSmoke; color:black"|<b>Ethanol fume dryer</b>
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|style="background:WhiteSmoke; color:black"|
*E-5
*E-5
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*B-1
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*C-1
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*D-3
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|style="background:WhiteSmoke; color:black"|
*D-3
*D-3
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|style="background:WhiteSmoke; color:black"|
*Drying
*Drying
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*Drying 
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*Drying
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*Drying
*Rinsing + drying
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|style="background:WhiteSmoke; color:black"|
*Drying
*Drying
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Drying
*Drying
*Rinsing + drying
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Drying sensitive samples. E.g. with cantilevers
*Drying sensitive samples. E.g. with cantilevers
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*1-25 150 mm wafers
*1-25 150 mm wafers
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|style="background:WhiteSmoke; color:black"|
*? 50 mm wafers
*1-25 50 mm wafers
*1-25 100 mm wafers
*1-25 100 mm wafers
*1-25 150 mm wafers  
*1-25 150 mm wafers
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*one 100 mm wafer
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*one 100 mm wafer
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*one 100 mm wafer
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|style="background:WhiteSmoke; color:black"|
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
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|style="background:WhiteSmoke; color:black"|
*Only for RCA cleaned wafers
*Only for RCA cleaned wafers
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*No restrictions
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*No restrictions
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*No restrictions
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|style="background:WhiteSmoke; color:black"|
*No restrictions
*No restrictions

Revision as of 10:57, 14 November 2014

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Drying Comparison Table

Equipment Spin dryer 1 Spin dryer 2 Spin dryer 3 Spin dryer 4 Single Wafer Spin dryer 1 Single Wafer Spin dryer 2 Single Wafer Spin dryer 3 Critical point dryer Ethanol fume dryer N2 guns
Location
  • C-1
  • B-1
  • D-3
  • E-5
  • B-1
  • C-1
  • D-3
  • D-3
  • C-1
  • In fumehoods and at chemical benches
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
  • Drying
  • Drying
  • Drying
  • Drying sensitive samples. E.g. with cantilevers
  • Drying sensitive samples. E.g. with cantilevers
  • Drying all kind of samples.
Batch size
  • 1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 50 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • one 100 mm wafer
  • one 100 mm wafer
  • one 100 mm wafer
  • 1 to 5 wafers per run. Sizes: 2”, 4" or 6"
  • Pieces (up to 10x10mm)
  • 1-25 50 mm wafers
  • 1-25 100 mm wafers
  • Pieces if a suitable carrier is available
  • One sample at a time
Allowed materials
  • No restrictions
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions
  • No restrictions
  • No restrictions
  • No restrictions
  • Si,SiO2, Si3N4
  • Quartz and Pyrex
  • InAlP, GaAs
  • SU8
  • No restriction except for polymers
  • No restriction


Choose a drying equipment