Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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 {| border="2" cellspacing="0" cellpadding="2"
-!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
+!colspan="1" border="none" style="background:silver; color:black;" align="center"|Equipment
 |style="background:WhiteSmoke; color:black"|<b>Spin dryer 1</b>
 |style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b>
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 |-
 !style="background:silver; color:black;" align="center" width="60"|Location
-|style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
 *C-1
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 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
-|style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
 *Drying
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 *Drying all kind of samples.
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+!style="background:silver; color:black;" align="center" width="60"|Batch size
-|style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
 *1-25 100 mm wafers
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 *One sample at a time
 |-
-| style="background:LightGrey; color:black"|Allowed materials
+!style="background:silver; color:black;" align="center" width="60"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
 *No restrictions