Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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|[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials] | |[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials] | ||
|High selectivity for dry etch. | |High selectivity for dry etch. | ||
Resist thickness 1 - 2 µm. | |||
|[[media:AZ_MiR_701.pdf|AZ_MiR_701.pdf]] | |[[media:AZ_MiR_701.pdf|AZ_MiR_701.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | |[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | ||
| Line 115: | Line 117: | ||
|[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials] | |[http://www.azem.com/en/Products/Litho-technology/Photoresists.aspx AZ Electronic Materials] | ||
|Negative sidewalls for lift-off. | |Negative sidewalls for lift-off. | ||
Resist thickness 1.5 - 3 µm. | |||
|[[media:AZ_nLOF_2020.pdf|AZ_nLOF_2020.pdf]] | |[[media:AZ_nLOF_2020.pdf|AZ_nLOF_2020.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | |[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | ||
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|[http://microchem.com/Prod-SU82000.htm Microchem] | |[http://microchem.com/Prod-SU82000.htm Microchem] | ||
|High aspect ratio. | |High aspect ratio. | ||
Resist thickness 1 µm to several 100 µm. | |||
|[[media:SU-8_DataSheet_2005.pdf|SU-8_DataSheet_2005.pdf]], [[media:SU-8_DataSheet_2075.pdf|SU-8_DataSheet_2075.pdf]] | |[[media:SU-8_DataSheet_2005.pdf|SU-8_DataSheet_2005.pdf]], [[media:SU-8_DataSheet_2075.pdf|SU-8_DataSheet_2075.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]] | |[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]] | ||