Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
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|General description | |'''General description''' | ||
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Etch of titanium with or without photoresist mask. | Etch of titanium with or without photoresist mask. | ||
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Etch of | Etch of | ||
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|Chemical solution | |'''Chemical solution''' | ||
|HF:NH<math>_4</math>F | |HF:NH<math>_4</math>F | ||
|. | |. | ||
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|Process temperature | |'''Process temperature''' | ||
|Room temperature | |Room temperature | ||
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|Possible masking materials | |'''Possible masking materials''' | ||
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Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||
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|Etch rate | |'''Etch rate''' | ||
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? | ? | ||
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? | ? | ||
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|Batch size | |'''Batch size''' | ||
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1-25 wafers at a time | 1-25 wafers at a time | ||
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1-25 wafer at a time | 1-25 wafer at a time | ||
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|Size of substrate | |'''Size of substrate''' | ||
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4" wafers | 4" wafers | ||
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4" wafers | 4" wafers | ||
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|Allowed materials | |'''Allowed materials''' | ||
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No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. | No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. |
Revision as of 12:58, 31 January 2008
Etching of Titanium
Etching of Titanium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fume hood in cleanroom 2. We have ?:
- BHF
Comparing the two solutions
BHF | ||
---|---|---|
General description |
Etch of titanium with or without photoresist mask. |
Etch of |
Chemical solution | HF:NHF | . |
Process temperature | Room temperature | |
Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
. |
Etch rate |
? |
? |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
4" wafers |
4" wafers |
Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. |
|