Specific Process Knowledge/Lithography/Baking: Difference between revisions
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==Fumehood | ==Fumehood hotplates== | ||
[[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]] | [[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]] | ||
Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist. | Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist. | ||