Specific Process Knowledge/Lithography/Baking: Difference between revisions

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 '''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking click here]'''
+=Comparing baking methods=
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-
+|-style="background:silver; color:black"
+!
+![[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
+![[Specific Process Knowledge/Lithography/Pretreatment#Buffered HF-Clean|Buffered HF-Clean]]
+![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Generel description
+|
+Vapor priming
+|
+Native oxide strip
+|
+Dehydration
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Chemical
+|
+hexamethyldisilazane (HMDS)
+|
+%HF with Ammoniumflouride
+|
+none
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Substrate size
+|
+* 50 mm wafers
+* 100 mm wafers
+* 150 mm wafers
+|
+* 100 mm wafers
+|
+* 100 mm wafers
+* 150 mm wafers
+|-
+|-style="background:LightGrey; color:black"
+!Allowed materials
+|
+Silicon, glass, and polymer substrates
+Film or pattern of all types
+|
+*Silicon
+*Poly Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Photoresist
+*Blue film
+|
+*Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Glass
+|-
+|-style="background:WhiteSmoke; color:black"
+!Restrictions
+|Type IV and resist/polymer on polymer substrate
+|Wafers with metal is not allowed
+|Resist is not allowed
+|-
+|}
+<br clear="all" />
 = Hotplates =