Specific Process Knowledge

2nd Level - Process Topic

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Choose the process topic you are interested in

• Back-end processing

• Characterization

• Direct Structure Definition

• Doping

• Etch

• Imprinting

• Lithography

• Thermal Process

• Thin film deposition

• Wafer and sample drying

• Wafer Bonding

• Wafer Cleaning

• Wafer Information

• Materials

• III-V Process

Overview of sample processing

Clean your sample Dry your sample Create a thin film on your sample Dope your sample Thermal treatment of your sample Make a mask on your sample Transfer pattern to your sample Define your structure directly Bond your samples together Characterize your sample Pack your sample	Clean your sample Entry page in LabAdviser Techniques Materials Wafer cleaning Soap Sonic Removes dust and particles 7-up & Piranha Removes traces of organics and alkali ions RCA Two step process to remove traces of organics and metals 5% HF Removes native oxide IMEC Removing dust, traces of organics and alkali ions and slightly polish the surface. Make the surface hydrophillic Dry your sample Entry page in LabAdviser Techniques Materials Wafer and sample drying Spin dryers Whole wafers Critial point dryer Sensitive wafers Ethanol fume drying Sensitive wafers N2 blow drying N2 pistols Create a layer/film on your sample Entry page in LabAdviser Techniques Materials Thermal Process/Oxidation Thermal oxidation Thermal SiO2 Thin film deposition Sputter deposition Metals: Ti, Cu, Al, Cr, Ag, Au, Pd, Ta, Cu, Ta, W, Mo, Co, Fe, Pt, Mg, Nb, Ni, Ru Semiconductors: Si, Ge Oxides: SiO2, ITO, ZnO, Al2O3, Cr2O3, MgO, Ta2O3 Alloys: NiV, MnIr, NiFe, AlCu, CoFe, CuTi, FeMn, NiCo Thermal evaporation Al, Ge, Ag E-beam evaporation Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Pd, Ag, Cu, W, Ta Semiconductors: Si, Ge Oxides: SiO2, TiOs Alloys: NiCr, TiAl LPCVD Si3N4, SRN, SiO2, Si (poly and amorph) PECVD Si3N4, SiO2, PBSG Electroplating Ni Epitaxial growth /MOCVD ? Lithography/Coaters Spin coating resists, polymers Spray coating resists, polymers Dope your sample Entry page in LabAdviser Techniques Materials Thin film deposition/PECVD PECVD Deposition of SiO2 or Si3N4 doped with P,B and Ge Thin film deposition/Furnace LPCVD PolySilicon LPCVD Deposition of PolySi doped with B or P Thermal Process/Dope with Boron Predeposition and drive-in Doping Silicon wafers with boron Thermal Process/Dope with Phosphorus Predeposition and drive-in Doping Silicon wafers with phosphorus Doping Ion implant ? Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing (>350C) Si, PECVD layers, Al, BCB curing, Polymer Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists: AZ, SU8, PDMS Rapid Thermal Anneal (RTP) SiO2, Si3N4, Ti, III-V Lithography/Baking Lithography/Pretreatment#Oven_250C Baking (<300dg) baking resist and polymers Make a mask on your sample Entry page in LabAdviser Techniques Materials Lithography Photolithography UV resists Deep UV lithography DUV resists E-beam lithography E-beam resists Imprinting Polymers Transfer mask pattern to your sample Entry page in LabAdviser Techniques Materials Etch Wet etch Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs Dry etch Any material Lithography/Lift-off Lift-off Most materials Define your structure directly Entry page in LabAdviser Techniques Materials Imprinting Imprinting TOPAS PMMA Lithography Lithographic definition SU8 AZ resists Direct Structure Definition Polymer Injection molding TOPAS Direct Structure Definition LASER micro machining Dicing saw Silicon Metal sheets Graphene (on silicon) Glass (Pyrex, fused silica) TOPAS PMMA Bond your samples together Entry page in LabAdviser Techniques Bonding Eutectic bonding Fusion bonding Anodic bonding Etch/DryEtchProcessing/Bonding Temporary bonding of wafers or chips for dry etching Characterize your sample Entry page in LabAdviser What do you need to measure? Technique/Method Characterization Sample Imaging, XY dimensions Microscopy: optical,SEM,AFM Sample Topography AFM,Profiling with stylus or optical Film thickness and optical constants Ellipsometry,Reflectometry,Prism Coupling Film Stress Profiling with stylus or optical Wafer thickness Element analysis XPS,EDX,SIMS Contact Angle Resistivity Four point probe Doping level/Carrier density Photoluminescence Pack your sample (back-end) Entry page in LabAdviser Techniques Back-end processing Chip/die mounting Wire bonding Dicing

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