Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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==Etching of Titanium==
==Etching of Titanium==
Etching of Titatium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fumehood in cleanroom 2. We have ?:
Etching of Titanium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fume hood in cleanroom 2. We have ?:


# BHF  
# BHF  
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|Allowed materials
|Allowed materials
|
|
No restrictions when used in beaker or PP-etch bath in the fumehood in cleanroom 2.  
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
|
|
*Aluminium
*Aluminium

Revision as of 11:38, 31 January 2008

Etching of Titanium

Etching of Titanium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fume hood in cleanroom 2. We have ?:

  1. BHF


Comparing the two solutions

BHF
General description

Etch of titanium with or without photoresist mask.

Etch of

Chemical solution HF:NHF .
Process temperature Room temperature
Possible masking materials:

Photoresist (1.5 µm AZ5214E)

.

Etch rate

?

?

Batch size

1-25 wafers at a time

1-25 wafer at a time

Size of substrate

4" wafers

4" wafers

Allowed materials

No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.

  • Aluminium
  • Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Photoresist
  • E-beam resist