Specific Process Knowledge/Wafer and sample drying/Spin Dryers: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 1</b> | |||
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b> | |||
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 3</b> | |||
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b> | |||
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!style="background:silver; color:black;" align="center" width="60"|Location | |||
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*C-1 | |||
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*B-1 | |||
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*D-4 | |||
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*E-5 | |||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
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*Drying | |||
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*Drying | |||
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*Drying | |||
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*Drying | |||
*Rinsing + drying | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Batch size | |||
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*1-25 100 mm wafers | |||
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*1-25 100 mm wafers | |||
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*1-25 100 mm wafers | |||
*1-25 150 mm wafers | |||
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*? 50 mm wafers | |||
*1-25 100 mm wafers | |||
*1-25 150 mm wafers | |||
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| style="background:LightGrey; color:black"|Allowed materials | |||
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*No restrictions | |||
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*Only for RCA cleaned wafers | |||
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*No restrictions | |||
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*No restrictions | |||
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