Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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 ==Etching of Titanium==
-Etching of Titatium is done wet at Danchip. We have ?:
+Etching of Titatium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fumehood in cleanroom 2. We have ?:
-# Standard BHF
+# BHF
-# ?
+#
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 {| border="1" cellspacing="0" cellpadding="4" align="left"
 !
-! Aluminium Etch 1
+! BHF
-! Aluminium Etch 2
+!
 |-
 |General description
 |
-Etch of pure aluminium
+Etch of titanium with or without photoresist mask.
 |
-Etch of aluminium + 1.5% Si
+Etch of
 |-
 |Chemical solution
-|H<math>_2</math>O:H<math>_3</math>PO<math>_4</math>  1:2
+|HF:NH<math>_4</math>F
-|PES 77-19-04
+|.
 |-
 |Process temperature
-|50 <sup>o</sup>C
+|Room temperature
-|20 <sup>o</sup>C
+|
 |-
@@ Line 34: / Line 34: @@
 Photoresist (1.5 µm AZ5214E)
 |
-Photoresist (1.5 µm AZ5214E)
+.
 |-
 |Etch rate
 |
-~100 nm/min (Pure Al)
+?
 |
-~60(??) nm/min
+?
 |-
 |Batch size
@@ Line 56: / Line 56: @@
 |Allowed materials
 |
-*Aluminium
+No restrictions when used in beaker or PP-etch bath in the fumehood in cleanroom 2.
-*Silicon
-*Silicon Oxide
-*Silicon Nitride
-*Silicon Oxynitride
-*Photoresist
-*E-beam resist
 |
 *Aluminium