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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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For convenience, the PEB and development function of the machine may be combined in one sequence.
For convenience, the PEB and development function of the machine may be combined in one sequence.


''Flow names and process parameters (Sequence no. 3000-3999):''
''Sequence names and process parameters (Sequence no. 3000-3999):''
*'''DCH 100mm PEB60s@110C+SP60s'''
*'''DCH 100mm PEB60s@110C+SP60s'''
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 60s' development.
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 60s' development.
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