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Specific Process Knowledge/Direct Structure Definition: Difference between revisions

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Jehan (talk | contribs)
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| The device is made using a series of short, high intensity light pulses to engrave a pattern in almost any material. Since the light pulses are very short (100ns or 10ps) the heating of the sample can be minimized, and material can be removed without any further sample deformation/melting.
| The device is made using a series of short, high intensity light pulses to engrave a pattern in almost any material. Since the light pulses are very short (100ns or 10ps) the heating of the sample can be minimized, and material can be removed without any further sample deformation/melting.
| The dicing saw is mostly used to seperate a silicon/glass wafer into individual chips. It can however also be used to make straight channels in glass/fused silica for e.g. fluidic components.  
| The dicing saw is mostly used to seperate a silicon/glass wafer into individual chips. It can however also be used to make straight channels in glass/fused silica for e.g. fluidic components.  
|-
|-
|-style="background:LightGrey; color:black"
!Allowed materials
|1
|2
|3
|4
|5
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Sample sizes
!Processable materials
|
*SU8
*AZ resists
|
|
*small samples
*SU8
*50 mm wafers
*AZ resists
*100 mm wafers
*150 mm wafers
|
|
*small samples
*TOPAS
*50 mm wafers
*PMMA
*100 mm wafers
*150 mm wafers
|
|
*small samples
*TOPAS
*50 mm wafers
*100 mm wafers
|flat disk tool: , luer tool:
|
|
*small samples
*Silicon
*50 mm wafers
*Metal sheets
*100 mm wafers
*Graphene (on silicon)
*150 mm wafers
*Glass (Pyrex, fused silica)
*larger samples
*TOPAS
*PMMA
*...
|
|
*small samples
*Silicon
*50 mm wafers
*Glass (Pyrex, fused silica)
*100 mm wafers
*150 mm wafers
|-
|-


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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Patterning degree of freedom
!Patterning degree of freedom
|1
|2
|3
|4
|5
|6
|-
|-
|-style="background:WhiteSmoke; color:black"
!Sample sizes
|
*small samples
*50 mm wafers
*100 mm wafers
*150 mm wafers
|
*small samples
*50 mm wafers
*100 mm wafers
*150 mm wafers
|
*small samples
*50 mm wafers
*100 mm wafers
|flat disk tool: , luer tool:
|
*small samples
*50 mm wafers
*100 mm wafers
*150 mm wafers
*larger samples
|
*small samples
*50 mm wafers
*100 mm wafers
*150 mm wafers
|-
|-
|-style="background:LightGrey; color:black"
!Allowed materials
|1
|1
|2
|2
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