Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions

![[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab300]]

![[Specific Process Knowledge/Thin film deposition/Lesker|Sputter System Lesker]]

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|Sputter deposition: can be done ontop of a large range of materials. This system can only run in depostion mode in certain periods.  

|Sputter deposition: can be done ontop of a large range of materials

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*~10nm - ~1µm(>2h)

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* Thin layers (up to 200-300 nm)

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*Not known

*Deposition on one side of the substrate

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*Less dense film

*Incorporation of hydrogen in the film

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*1x4" wafer or

*1x6" wafer

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* Metals  

* Carbon

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