Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | |||
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! General description | ! General description | ||
|E-beam deposition of Cu | |E-beam deposition of Cu | ||
|Sputter deposition of Cu | |||
|Sputter deposition of Cu | |Sputter deposition of Cu | ||
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!Pre-clean | !Pre-clean | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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!Layer thickness | !Layer thickness | ||
|10Å to 0.5µm* | |10Å to 0.5µm* | ||
| | |10Å to 1µm* | ||
10Å to 1µm* | |10Å to 1µm* | ||
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Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | ||
| ~1Å/s | |||
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* 12x4" wafers or | * 12x4" wafers or | ||
* 12x2" wafers | * 12x2" wafers | ||
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*smaller pieces | |||
*Up to 1x6" wafers | |||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
| almost any | |||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
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Revision as of 13:42, 13 October 2014
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Deposition of Cu
Copper can be deposited by e-beam evaporation or sputtering . In the chart below you can compare the different deposition equipment.
Deposition of Copper using sputter deposition technique
| E-beam evaporation (Alcatel) | Sputter deposition (PVD co-sputter/evaporation) | Sputter deposition (Lesker) | |
|---|---|---|---|
| General description | E-beam deposition of Cu | Sputter deposition of Cu | Sputter deposition of Cu |
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 0.5µm* | 10Å to 1µm* | 10Å to 1µm* |
| Deposition rate | 2Å/s to 15Å/s |
Depending on process parameters |
~1Å/s |
| Batch size |
|
|
|
| Allowed materials |
|
|
almost any |
| Comment |
* To deposit layers thicker then 200 nm permission is required (contact Thin film group)
Studies of Cu deposition processes
Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel