Specific Process Knowledge/Direct Structure Definition: Difference between revisions
| Line 9: | Line 9: | ||
== Choose method of structuring/equipment == | == Choose method of structuring/equipment == | ||
* [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] | |||
* [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] | * [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]] | ||
* [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | |||
* [[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | * [[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | ||
* [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]] | * [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]] | ||
* [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]] | * [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]] | ||