Jump to content

Specific Process Knowledge/Doping: Difference between revisions

Bghe (talk | contribs)
Kabi (talk | contribs)
Line 28: Line 28:
|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Method 1]]
![[Specific_Process_Knowledge/Thermal_Process/A4_Phosphor_Pre-dep_furnace|Phosphor predep]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Method 2]]
![[Specific_Process_Knowledge/Thermal_Process/A1_Bor_Drive-in_furnace|Boron predep]]
![[Specific Process Knowledge/Thin_film_deposition/Furnace_LPCVD_PolySilicon|Doped Poly Si]]
![[Specific Process Knowledge/Thin_film_deposition/PECVD|PECVD doped thin film]]
|-
|-


Line 35: Line 37:
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Generel description - method 1
|Dopants introduced by Diffusion from gas-phase (POCL)
|Generel description - method 2
|Dopants introduced by Diffusion from solid source wafers
|Dopants introduced by in-situ doping of poly/amorphous Si
|Deposition of doped thin film (doped oxides or nitrides)
|-
|-


Line 42: Line 46:
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Parameter 1
!Parameter 1
|
*A
*B
|
*A
*B
|
|
*A
*A