Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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*Glass | *Glass | ||
**[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]] | **[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]] | ||
** dicing saw | |||
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]] | **[[/Sandblasting|Sandblasting (at DTU Nanotech).]] | ||
Revision as of 12:41, 6 October 2014
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Direct Structure Definiton
By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps.
Advantages of direct structure definition may be ..
- Quicker process because no need for masking steps
- In some cases the structure is defined directly by a computer, so changes in the design can be made very quickly.
Dis-advantages could be
- Limited choice of materials
- Limited resolution
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Choose method of structuring/equipment
Materials for structuring
- Polymers
- Metals
- Silicon
- Glass
- Laser ablation
- dicing saw
- Sandblasting (at DTU Nanotech).
Choose equipment
- Laser Micromachining Tool
- Polymer Injection Molder
- Nano Imprint Lithography
- 2-Photon Polymerization Lithography
Comparison of equipment/material
Polymers | Nano Imprint Lithography | 2-Photon Polymerization Lithography | Polymer Injection Molder | Laser Micromachining Tool |
---|---|---|---|---|
Generel description | Low Pressure Chemical Vapour Deposition (LPCVD furnace process) | Plasma Enhanced Chemical Vapour Deposition (PECVD process) | Reactive sputtering | |
Allowed materials |
Processed wafers have to be RCA cleaned |
|
Any |
Metals/Silicon/Glass | Nano Imprint Lithography | 2-Photon Polymerization Lithography | Polymer Injection Molder | Laser Micromachining Tool |
---|---|---|---|---|
Generel description | Low Pressure Chemical Vapour Deposition (LPCVD furnace process) | Plasma Enhanced Chemical Vapour Deposition (PECVD process) | Reactive sputtering | |
Allowed materials |
Processed wafers have to be RCA cleaned |
|
Any |