Specific Process Knowledge/Direct Structure Definition: Difference between revisions

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 |-style="background:silver; color:black"
-! Polymers
+! '''Polymers'''
 ![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
 ![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
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 |-
 |}
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-
+|-style="background:silver; color:black"
+! '''Metals/Silicon/Glass'''
+![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
+![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
+![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
+![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Generel description
+|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
+|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
+|Reactive sputtering
+|
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Allowed materials
+|
+*Silicon
+*Silicon oxide
+*Silicon nitride
+*Pure quartz (fused silica)
+Processed wafers have to be RCA cleaned
+|
+*Silicon
+*Silicon oxide (with boron, phosphorous and germanium)
+*Silicon nitrides (with boron, phosphorous and germanium)
+*Pure quartz (fused silica)
+|Any
+|
+|-
+|}
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